Messages in this thread | | | Date | Thu, 28 Sep 2023 09:10:26 +0200 | Subject | Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used for cooling device binding | From | Daniel Lezcano <> |
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On 21/09/2023 20:01, Rafael J. Wysocki wrote: > From: Rafael J. Wysocki <rafael.j.wysocki@intel.com> > > Add new helper functions, thermal_bind_cdev_to_trip() and > thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for > binding a cooling device to a trip point and unbinding it, respectively, > and redefine the existing helpers, thermal_zone_bind_cooling_device() > and thermal_zone_unbind_cooling_device(), as wrappers around the new > ones, respectively. > > No intentional functional impact. > > Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> > ---
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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