Messages in this thread | | | Date | Thu, 28 Sep 2023 15:31:47 +0200 | Subject | Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used for cooling device binding | From | Daniel Lezcano <> |
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On 28/09/2023 12:38, Rafael J. Wysocki wrote: > On Thu, Sep 28, 2023 at 9:10 AM Daniel Lezcano > <daniel.lezcano@linaro.org> wrote: >> >> On 21/09/2023 20:01, Rafael J. Wysocki wrote: >>> From: Rafael J. Wysocki <rafael.j.wysocki@intel.com> >>> >>> Add new helper functions, thermal_bind_cdev_to_trip() and >>> thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for >>> binding a cooling device to a trip point and unbinding it, respectively, >>> and redefine the existing helpers, thermal_zone_bind_cooling_device() >>> and thermal_zone_unbind_cooling_device(), as wrappers around the new >>> ones, respectively. >>> >>> No intentional functional impact. >>> >>> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> >>> --- >> >> Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org> > > Thanks so much for all of the reviews!
You are welcome. Thanks for cleaning up the ACPI code
> I'll now apply the patches for which you have given tags and respin > the rest (governor changes) as a separate series on top of them.
Sounds good, thanks
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