Messages in this thread Patch in this message | | | From | Konrad Dybcio <> | Subject | [PATCH 14/39] arm64: dts: qcom: sdm630: Add TSENS node | Date | Thu, 29 Jul 2021 00:25:17 +0200 |
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This will enable temperature reporting for various SoC components.
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org> Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org> --- .../devicetree/bindings/thermal/qcom-tsens.yaml | 1 + arch/arm64/boot/dts/qcom/sdm630.dtsi | 11 +++++++++++ 2 files changed, 12 insertions(+)
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index 4a2eaf28e3fd..d3b9e9b600a2 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml @@ -48,6 +48,7 @@ properties: - qcom,sc7180-tsens - qcom,sc7280-tsens - qcom,sc8180x-tsens + - qcom,sdm630-tsens - qcom,sdm845-tsens - qcom,sm8150-tsens - qcom,sm8250-tsens diff --git a/arch/arm64/boot/dts/qcom/sdm630.dtsi b/arch/arm64/boot/dts/qcom/sdm630.dtsi index 1e54828817d5..7e9c80e35fba 100644 --- a/arch/arm64/boot/dts/qcom/sdm630.dtsi +++ b/arch/arm64/boot/dts/qcom/sdm630.dtsi @@ -627,6 +627,17 @@ mnoc: interconnect@1745000 { <&mmcc AHB_CLK_SRC>; }; + tsens: thermal-sensor@10ae000 { + compatible = "qcom,sdm630-tsens", "qcom,tsens-v2"; + reg = <0x010ae000 0x1000>, /* TM */ + <0x010ad000 0x1000>; /* SROT */ + #qcom,sensors = <12>; + interrupts = <GIC_SPI 184 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 430 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + tcsr_mutex_regs: syscon@1f40000 { compatible = "syscon"; reg = <0x01f40000 0x20000>; -- 2.32.0
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