Messages in this thread | | | Date | Fri, 5 Apr 2019 20:33:07 +0200 (CEST) | From | Thomas Gleixner <> | Subject | Re: [PATCH 0/14] v2 multi-die/package topology support |
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On Tue, 26 Feb 2019, Len Brown wrote:
> This patch series does 4 things. > > 1. Parses the new CPUID.1F leaf to discover multi-die/package topology > > 2. Export multi-die topology inside the kernel > > 3. Update 3 places (coretemp, pkgtemp, rapl) that that need to know > the difference between die and package-scope MSR. > > (Note: Kan Liang has a patch series on top of this one to similarly > make the uncore perf code multi-die/package aware.) > > 4. Export multi-die topology to user-space via sysfs
Aside of the few nitpicks (which apply to several patches) this looks very nice.
Thanks,
tglx
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