Messages in this thread | | | Date | Tue, 30 Apr 2019 11:33:38 +0200 | From | Borislav Petkov <> | Subject | Re: [PATCH 0/14] v2 multi-die/package topology support |
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On Tue, Apr 30, 2019 at 02:50:58AM -0400, Len Brown wrote: > If one were to make a change here, I'd consider adding the (physical) die_id, > though it is already in sysfs topology as an attribute.
From: Documentation/x86/topology.txt
"The kernel does not care about the concept of physical sockets because a socket has no relevance to software. It's an electromechanical component. In the past a socket always contained a single package (see below), but with the advent of Multi Chip Modules (MCM) a socket can hold more than one package. So there might be still references to sockets in the code, but they are of historical nature and should be cleaned up."
So that die thing has only small relevance to some software, as you say:
"These topology changes primarily impact parts of the kernel and some applciations that care about package MSR scope."
So if there's no real need to add it there, then it probably shouldn't be added. The topology is already too complex - so much so, that tools are even generating PDFs from it :)
-- Regards/Gruss, Boris.
Good mailing practices for 400: avoid top-posting and trim the reply.
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