Messages in this thread | | | Date | Thu, 12 Oct 2023 13:01:00 +0100 | Subject | Re: [PATCH 1/2] thermal/core: Hardening the self-encapsulation | From | Lukasz Luba <> |
| |
Hi Daniel,
On 10/12/23 11:26, Daniel Lezcano wrote: > The thermal private header has leaked all around the drivers which > interacted with the core internals. The thermal zone structure which > was part of the exported header led also to a leakage of the fields > into the different drivers, making very difficult to improve the core > code without having to change the drivers. > > Now we mostly fixed how the thermal drivers were interacting with the > thermal zones (actually fixed how they should not interact). The > thermal zone structure will be moved to the private thermal core > header. This header has been removed from the different drivers and > must belong to the core code only. In order to prevent this private > header to be included again in the drivers, make explicit only the > core code can include this header by defining a THERMAL_CORE_SUBSYS > macro. The private header will contain a check against this macro. > > The Tegra SoCtherm driver needs to access thermal_core.h to have the > get_thermal_instance() function definition. It is the only one > remaining driver which need to access the thermal_core.h header, so > the check will emit a warning at compilation time. > > Thierry Reding is reworking the driver to get rid of this function [1] > and thus when the changes will be merged, the compilation warning will > be converted to a compilation error, closing definitively the door to > the drivers willing to play with the thermal zone device internals.
That looks like a good idea. Although, shouldn't we avoid the compilation warnings and just first merge the fixes for drivers?
Regards, Lukasz
| |