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Subject[RESEND PATCH] dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7
Date
The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device. This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
---

Resending because it is waiting for half a year.



Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml | 1 +
1 file changed, 1 insertion(+)

diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml
index d20569b9b763..52ec18cf1eda 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml
@@ -13,6 +13,7 @@ properties:
enum:
- qcom,spmi-adc-tm5
- qcom,spmi-adc-tm5-gen2
+ - qcom,adc-tm7 # Incomplete / subject to change

reg:
maxItems: 1
--
2.34.1
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