Messages in this thread | | | Subject | Re: [PATCH v6 0/4] thermal: k3: Add support for bandgap sensors | From | Tero Kristo <> | Date | Thu, 9 Apr 2020 17:37:05 +0300 |
| |
On 09/04/2020 17:07, J, KEERTHY wrote: > > > On 4/9/2020 7:19 PM, Daniel Lezcano wrote: >> >> Hi Keerthy, >> >> On 07/04/2020 07:51, Keerthy wrote: >>> Add VTM thermal support. In the Voltage Thermal >>> Management Module(VTM), K3 AM654 supplies a voltage >>> reference and a temperature sensor feature that are gathered in the band >>> gap voltage and temperature sensor (VBGAPTS) module. The band >>> gap provides current and voltage reference for its internal >>> circuits and other analog IP blocks. The analog-to-digital >>> converter (ADC) produces an output value that is proportional >>> to the silicon temperature. >>> >>> Add support for bandgap sensors. Currently reading temperatures >>> is supported. >> >> How do you want to proceed? Shall I take patches 1 & 2 ? > > +Tero > > Hi Tero, > > Can you pull 3 & 4? Or Daniel can take all 4?
Let me pull the DT patches, that way we avoid any conflicts in the arm64/dts tree. There has been quite a bit of traffic on that front lately and we did mess up something with the current merge window already.
I believe you are picking the driver side changes to 5.8?
-Tero
> > - Keerthy > >> >> >>> Changes in v6: >>> >>> * Removed bunch of unused #defines and couple of redundant variables. >>> * Reordered patches a bit. >>> * Minor reordering in dt binding patch. >>> >>> Changes in v5: >>> >>> * Removed thermal work function which was unused. >>> * Removed unused preve_tenmp and a couple more struct variables. >>> * Removed couple of redundant header function include. >>> >>> Changes in v4: >>> >>> * Fixed comments from Daniel to remove trend function. >>> * Mostly cleaned up all the unused variables. >>> * Driver from bool to tristate. >>> >>> Changes in v3: >>> >>> * Fixed errors seen with: >>> dt_binding_check >>> DT_SCHEMA_FILES=Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml >>> >>> >>> Changes in v2: >>> >>> * Fixed yaml errors >>> * renamed am654-industrial-thermal.dtsi to >>> k3-am654-industrial-thermal.dtsi >>> to follow the convention for k3 family. >>> >>> Keerthy (4): >>> dt-bindings: thermal: k3: Add VTM bindings documentation >>> thermal: k3: Add support for bandgap sensors >>> arm64: dts: ti: am65-wakeup: Add VTM node >>> arm64: dts: ti: am654: Add thermal zones >>> >>> .../bindings/thermal/ti,am654-thermal.yaml | 56 ++++ >>> arch/arm64/boot/dts/ti/k3-am65-wakeup.dtsi | 11 + >>> .../dts/ti/k3-am654-industrial-thermal.dtsi | 45 +++ >>> drivers/thermal/Kconfig | 10 + >>> drivers/thermal/Makefile | 1 + >>> drivers/thermal/k3_bandgap.c | 264 ++++++++++++++++++ >>> 6 files changed, 387 insertions(+) >>> create mode 100644 >>> Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml >>> create mode 100644 >>> arch/arm64/boot/dts/ti/k3-am654-industrial-thermal.dtsi >>> create mode 100644 drivers/thermal/k3_bandgap.c >>> >> >>
-- Texas Instruments Finland Oy, Porkkalankatu 22, 00180 Helsinki. Y-tunnus/Business ID: 0615521-4. Kotipaikka/Domicile: Helsinki
| |