Messages in this thread | | | Date | Wed, 31 Oct 2012 23:09:48 +0530 | From | Laxman Dewangan <> | Subject | Re: [PATCH V4 3/4] ARM: tegra: dts: cardhu: enable SLINK4 |
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On Wednesday 31 October 2012 10:14 PM, Stephen Warren wrote: > On 10/31/2012 03:02 AM, Laxman Dewangan wrote: >> Enable SLINK4 and connected device in Tegra30 based >> platform Cardhu. >> Setting maximum spi frequency to 25MHz. >> >> Spi serial flash is connected on CS1 of SLINK4 on >> cardhu platform. >> diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt >> +winbond Winbond Electronics corp. > That should really be a separate patch that goes through the devicetree > branch. But I guess it's fairly trivial, so it's not a big deal. >
Yes, I thought that it should be in separate change. I did same on earlier for ISL29028 driver and found that this small change still not get merged. Therefore I clubbed this together as it can go without any issue. I believe it is fine to merge vendor-prefix from any tree.
> >> + spi-flash@1 { >> + compatible = "winbond,w25q32"; >> + spi-max-frequency =<20000000>; >> + reg =<1>; >> + }; > Since I have an Atmel flash on my board, I see: > > [ 1.282958] m25p80 spi32766.1: found at25df321a, expected w25q32 > [ 1.289103] m25p80 spi32766.1: at25df321a (4096 Kbytes) > > Is there any way around that (the first log line above)? > > I suppose the answer is that the DT should reflect the exact flash > device that's on the board, and perhaps the bootloader should be > adjusting the DT to reflect the correct value. That's probably complex. > > Do you have any idea whether Atmel or Winbond flash is more common, so > we can at least minimize the number of times this message appears?
I observe that most of cardhu have the winbond. All SQA machine has winbond. Also I believe on A04, it is winbond. Better to go with winbond.
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