Messages in this thread | | | Date | Tue, 30 Apr 2024 14:15:34 +0200 | Subject | Re: [PATCH v6 4/5] sched: Rename arch_update_thermal_pressure into arch_update_hw_pressure | From | Konrad Dybcio <> |
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On 30.04.2024 2:00 PM, Vincent Guittot wrote: > H Konrad, > > On Tue, 30 Apr 2024 at 13:23, Konrad Dybcio <konrad.dybcio@linaro.org> wrote: >> >> On 26.03.2024 10:16 AM, Vincent Guittot wrote: >>> Now that cpufreq provides a pressure value to the scheduler, rename >>> arch_update_thermal_pressure into HW pressure to reflect that it returns >>> a pressure applied by HW (i.e. with a high frequency change) and not >>> always related to thermal mitigation but also generated by max current >>> limitation as an example. Such high frequency signal needs filtering to be >>> smoothed and provide an value that reflects the average available capacity >>> into the scheduler time scale. >>> >>> Signed-off-by: Vincent Guittot <vincent.guittot@linaro.org> >>> Reviewed-by: Qais Yousef <qyousef@layalina.io> >>> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> >>> Tested-by: Lukasz Luba <lukasz.luba@arm.com> >>> --- >> >> Hi, I'm not quite sure how, but this commit specifically breaks booting >> on Qualcomm platforms with EAS.. > > This is the fix: > https://lore.kernel.org/lkml/20240425073709.379016-1-vincent.guittot@linaro.org/
Yep, works now!
> >> >> https://pastebin.com/raw/1Uh7u81x > > Which platform is it ? > I tested it on dragonboard rb3 and it booted and run tests even w/o the fix
As the log suggests, SM8550 QRD
Thanks for your prompt response!
Konrad
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