Messages in this thread | | | From | Vincent Guittot <> | Date | Tue, 30 Apr 2024 14:00:46 +0200 | Subject | Re: [PATCH v6 4/5] sched: Rename arch_update_thermal_pressure into arch_update_hw_pressure |
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H Konrad,
On Tue, 30 Apr 2024 at 13:23, Konrad Dybcio <konrad.dybcio@linaro.org> wrote: > > On 26.03.2024 10:16 AM, Vincent Guittot wrote: > > Now that cpufreq provides a pressure value to the scheduler, rename > > arch_update_thermal_pressure into HW pressure to reflect that it returns > > a pressure applied by HW (i.e. with a high frequency change) and not > > always related to thermal mitigation but also generated by max current > > limitation as an example. Such high frequency signal needs filtering to be > > smoothed and provide an value that reflects the average available capacity > > into the scheduler time scale. > > > > Signed-off-by: Vincent Guittot <vincent.guittot@linaro.org> > > Reviewed-by: Qais Yousef <qyousef@layalina.io> > > Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> > > Tested-by: Lukasz Luba <lukasz.luba@arm.com> > > --- > > Hi, I'm not quite sure how, but this commit specifically breaks booting > on Qualcomm platforms with EAS..
This is the fix: https://lore.kernel.org/lkml/20240425073709.379016-1-vincent.guittot@linaro.org/
> > https://pastebin.com/raw/1Uh7u81x
Which platform is it ? I tested it on dragonboard rb3 and it booted and run tests even w/o the fix
> > Konrad
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