Messages in this thread | | | Date | Sat, 19 Aug 2023 21:05:24 +0200 | From | Simon Horman <> | Subject | Re: [PATCH v2 3/4] net: stmmac: Add glue layer for Loongson-1 SoC |
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On Wed, Aug 16, 2023 at 07:13:09PM +0800, Keguang Zhang wrote: > This glue driver is created based on the arch-code > implemented earlier with the platform-specific settings. > > Use syscon for SYSCON register access. > > Partialy based on the previous work by Serge Semin.
Hi Keguang Zhang,
as it looks like there will be a v3 for other reasons, a minor nit from my side: Partialy -> Partially
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