Messages in this thread | | | Date | Tue, 19 Dec 2023 15:16:29 +0800 | From | kernel test robot <> | Subject | Re: [PATCH v2 1/2] thermal/debugfs: Add thermal cooling device debugfs information |
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Hi Daniel,
kernel test robot noticed the following build warnings:
[auto build test WARNING on rafael-pm/thermal] [also build test WARNING on linus/master v6.7-rc6 next-20231218] [If your patch is applied to the wrong git tree, kindly drop us a note. And when submitting patch, we suggest to use '--base' as documented in https://git-scm.com/docs/git-format-patch#_base_tree_information]
url: https://github.com/intel-lab-lkp/linux/commits/Daniel-Lezcano/thermal-debugfs-Add-thermal-debugfs-information-for-mitigation-episodes/20231219-012118 base: https://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm.git thermal patch link: https://lore.kernel.org/r/20231218171942.3048095-1-daniel.lezcano%40linaro.org patch subject: [PATCH v2 1/2] thermal/debugfs: Add thermal cooling device debugfs information config: x86_64-allyesconfig (https://download.01.org/0day-ci/archive/20231219/202312191425.5o49Dzmt-lkp@intel.com/config) compiler: clang version 16.0.4 (https://github.com/llvm/llvm-project.git ae42196bc493ffe877a7e3dff8be32035dea4d07) reproduce (this is a W=1 build): (https://download.01.org/0day-ci/archive/20231219/202312191425.5o49Dzmt-lkp@intel.com/reproduce)
If you fix the issue in a separate patch/commit (i.e. not just a new version of the same patch/commit), kindly add following tags | Reported-by: kernel test robot <lkp@intel.com> | Closes: https://lore.kernel.org/oe-kbuild-all/202312191425.5o49Dzmt-lkp@intel.com/
All warnings (new ones prefixed by >>):
>> drivers/thermal/thermal_debugfs.c:73: warning: cannot understand function prototype: 'struct cdev_value ' >> drivers/thermal/thermal_debugfs.c:91: warning: cannot understand function prototype: 'struct thermal_debugfs ' >> drivers/thermal/thermal_debugfs.c:370: warning: bad line:
vim +73 drivers/thermal/thermal_debugfs.c
60 61 /** 62 * cdev_value - Common structure for cooling device entry 63 * 64 * The following common structure allows to store the information 65 * related to the transitions and to the state residencies. They are 66 * identified with a id which is associated to a value. It is used as 67 * nodes for the "transitions" and "durations" above. 68 * 69 * @node: node to insert the structure in a list 70 * @id: identifier of the value which can be a state or a transition 71 * @value: the id associated value which can be a duration or an occurrence 72 */ > 73 struct cdev_value { 74 struct list_head node; 75 int id; 76 u64 value; 77 }; 78 79 /** 80 * thermal_debugfs - High level structure for a thermal object in 81 * debugfs 82 * 83 * The thermal_debugfs structure is the common structure used by the 84 * cooling device to compute the statistics. 85 * 86 * @d_top: top directory of the thermal object directory 87 * @lock: per object lock to protect the internals 88 * 89 * @cdev: a cooling device debug structure 90 */ > 91 struct thermal_debugfs { 92 struct dentry *d_top; 93 struct mutex lock; 94 union { 95 struct cdev_debugfs cdev; 96 }; 97 }; 98
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