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    SubjectRe: [PATCH 00/12] usb: dwc3: qcom: Flatten dwc3 structure
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    Hi Bjorn,

    On Mon, Oct 16, 2023, Bjorn Andersson wrote:
    > The USB IP-block found in most Qualcomm platforms is modelled in the
    > Linux kernel as 3 different independent device drivers, but as shown by
    > the already existing layering violations in the Qualcomm glue driver
    > they can not be operated independently.
    >
    > With the current implementation, the glue driver registers the core and
    > has no way to know when this is done. As a result, e.g. the suspend
    > callbacks needs to guard against NULL pointer dereferences when trying
    > to peek into the struct dwc3 found in the drvdata of the child.
    >
    > Missing from the upstream Qualcomm USB support is handling of role
    > switching, in which the glue needs to be notified upon DRD mode changes.
    > Several attempts has been made through the years to register callbacks
    > etc, but they always fall short when it comes to handling of the core's
    > probe deferral on resources etc.
    >
    > Furhtermore, the DeviceTree binding is a direct representation of the
    > Linux driver model, and doesn't necessarily describe "the USB IP-block".
    >
    > This series therefor attempts to flatten the driver split, and operate
    > the glue and core out of the same platform_device instance. And in order
    > to do this, the DeviceTree representation of the IP block is flattened.
    >
    > As a side effect, much of the ACPI integration code is dropped.
    >
    > Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com>
    > ---
    > Bjorn Andersson (12):
    > dt-bindings: usb: qcom,dwc3: Add qcom,sc8180x-dwc3
    > usb: dwc3: qcom: Rename dwc3 platform_device reference
    > usb: dwc3: qcom: Merge resources from urs_usb device
    > usb: dwc3: Expose core driver as library
    > usb: dwc3: Override end of dwc3 memory resource
    > usb: dwc3: qcom: Add dwc3 core reference in driver state
    > usb: dwc3: qcom: Instantiate dwc3 core directly
    > usb: dwc3: qcom: Inline the qscratch constants
    > dt-bindings: usb: qcom,dwc3: Rename to "glue"
    > dt-bindings: usb: qcom,dwc3: Introduce flattened qcom,dwc3 binding
    > usb: dwc3: qcom: Flatten the Qualcomm dwc3 binding and implementation
    > arm64: dts: qcom: sc8180x: flatten usb_sec node
    >
    > .../devicetree/bindings/usb/qcom,dwc3-glue.yaml | 626 +++++++++++++++++++++
    > .../devicetree/bindings/usb/qcom,dwc3.yaml | 321 ++++-------
    > .../devicetree/bindings/usb/snps,dwc3.yaml | 14 +-
    > .../arm64/boot/dts/qcom/sc8180x-lenovo-flex-5g.dts | 6 +-
    > arch/arm64/boot/dts/qcom/sc8180x-primus.dts | 6 +-
    > arch/arm64/boot/dts/qcom/sc8180x.dtsi | 34 +-
    > drivers/usb/dwc3/core.c | 136 +++--
    > drivers/usb/dwc3/core.h | 10 +
    > drivers/usb/dwc3/dwc3-qcom.c | 328 ++++++-----
    > 9 files changed, 1057 insertions(+), 424 deletions(-)
    > ---
    > base-commit: 4d0515b235dec789578d135a5db586b25c5870cb
    > change-id: 20231016-dwc3-refactor-931e3b08a8b9
    >
    > Best regards,
    > --
    > Bjorn Andersson <quic_bjorande@quicinc.com>
    >

    First of all, thanks for the work.

    I just did a quick review through the changes, and I think it's great!
    (This will address some issues I also have with dwc3 currently too.)

    BR,
    Thinh
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