Messages in this thread | | | Date | Mon, 8 Aug 2022 13:06:41 +0200 | Subject | Re: [PATCH v5 00/33] New thermal OF code | From | Daniel Lezcano <> |
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On 08/08/2022 12:55, Michael Walle wrote: > Hi Daniel,
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>>> There seems to be one mistake within the new thermal code:
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>>> This was seen a sl28 board >>> (arch/arm64/boot/dts/freescale/fsl-ls1028a-kontron-kbox-a-230-ls.dts). >>> The same board in the KernelCI also have some more information: >>> https://lavalab.kontron.com/scheduler/job/151900#L1162 >>> >>> But I guess even if that is fixed, the driver will not probe due to the >>> missing trip points? Are they now mandatory? Does it mean we'd need to >>> update our device trees? But that will then mean older devices trees >>> don't work anymore. >> >> Thanks for reporting, I'll investigate the issues you are reporting. >> >> There is no need to update any device tree file. The code does not >> change the bindings, it is a rewrite of the implementation supposed to >> be without impact on the existing bindings, thus the existing device >> tree descriptions. >> >> Why are you saying there are missing trip points ? The dts shows trip >> points for 'core-cluster' and 'ddr-controller' ? > > You are right. I've just looked at the error message: > > [ 2.030452] thermal_sys: Failed to find 'trips' node > [ 2.033664] usb 1-1: new high-speed USB device number 2 using xhci-hcd > [ 2.035434] thermal_sys: Failed to find trip points for tmu id=2 > > So maybe the code just don't find em.
For the board it seems there is no definition for tmu with id 2
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