Messages in this thread | | | Date | Thu, 28 Jul 2022 17:12:16 +0200 | Subject | Re: [PATCH v3 00/32] New thermal OF code | From | Daniel Lezcano <> |
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Hi Rafael,
On 28/07/2022 16:37, Rafael J. Wysocki wrote: > Hi Daniel, > > On Wed, Jul 27, 2022 at 11:46 PM Daniel Lezcano > <daniel.lezcano@linaro.org> wrote: >> >> >> Hi Rafael, >> >> we are close to release v5.19. >> >> I want to send a PR this week but it would be nice if this series could >> be part of it, so the trip point rework we discussed earlier (it is a >> long series) could be merged more easily for v5.21-rc1 as it will depend >> on these changes. >> >> This series was tested on different platforms, rk3399, broadcom and >> rcar. The external drivers as ata, touchscreen, regulator, hwmon were >> acked/reviewed and some other thermal drivers reviewed also. Some others >> remain without feedback because the maintainer is unresponsive or the >> driver is orphaned, falling under the thermal framework maintenance >> umbrella. All the drivers changes are the same. >> >> I do believe it does a nice cleanup and consolidation of the OF thermal >> code and realign it with the core thermal framework. >> >> Is it ok to merge the series? > > I would prefer to put it into linux-next for a few days. > > Why don't you send 2 pull requests, one with all of the other material > you have for 5.20 and another one with this series (it may be on top > of the first one)? > > I will be able to defer pushing the second one till the second half of > the merge window.
Yes, I agree, if it is fine to do two pull requests, it seems very reasonable to let this series to mature in linux-next.
I will setup the 'next' branch with the first pull request material.
Thanks
-- Daniel
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