Messages in this thread | | | Date | Wed, 4 May 2022 15:10:44 -0500 | From | Rob Herring <> | Subject | Re: [PATCH v4 1/5] dt-bindings: thermal: tsens: Add ipq8074 compatible |
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On Tue, May 03, 2022 at 10:08:09PM +0200, Robert Marko wrote: > Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it > only uses one IRQ, so tsens v2 compatible cannot be used as the fallback. > > We also have to make sure that correct interrupts are set according to > compatibles, so populate interrupt information per compatibles. > > Signed-off-by: Robert Marko <robimarko@gmail.com> > Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> > --- > Changes in v4: > * Add the forgotten Reviewed-by tag from Krzysztof > > Changes in v3: > * Remove implied min/maxItem properties as pointed by Rob > > Changes in v2: > * No need for a list in compatible check > * Specify minItems and maxItems for interrupt and interrupt-names > --- > .../bindings/thermal/qcom-tsens.yaml | 76 ++++++++++++++++--- > 1 file changed, 65 insertions(+), 11 deletions(-)
Reviewed-by: Rob Herring <robh@kernel.org>
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