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SubjectRe: [PATCH] thermal: core: fix memory leak in __thermal_cooling_device_register()
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On 11/05/2022 04:06, Yang Yingliang wrote:
> I got memory leak as follows when doing fault injection test:
>
> unreferenced object 0xffff888010080000 (size 264312):
> comm "182", pid 102533, jiffies 4296434960 (age 10.100s)
> hex dump (first 32 bytes):
> 00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00 .....N..........
> ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff ........@.......
> backtrace:
> [<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969
> [<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510
> [<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586
> [<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927
> [<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041
> [<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211
> [<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561
>
> If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called
> to free the memory allocated in thermal_cooling_device_setup_sysfs().
>
> Fixes: 8ea229511e06 ("thermal: Add cooling device's statistics in sysfs")
> Reported-by: Hulk Robot <hulkci@huawei.com>
> Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
> ---
> drivers/thermal/thermal_core.c | 1 +
> 1 file changed, 1 insertion(+)

Applied, thanks


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