Messages in this thread | | | Date | Wed, 11 May 2022 13:23:27 +0530 | Subject | Re: [PATCH v6 1/4] dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation | From | "J, KEERTHY" <> |
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On 5/9/2022 12:12 PM, Krzysztof Kozlowski wrote: > On 09/05/2022 05:18, J, KEERTHY wrote: >> >> >> On 4/27/2022 12:16 PM, Keerthy wrote: >>> Add VTM bindings documentation. In the Voltage Thermal >>> Management Module(VTM), K3 J72XX supplies a voltage >>> reference and a temperature sensor feature that are gathered in the band >>> gap voltage and temperature sensor (VBGAPTS) module. The band >>> gap provides current and voltage reference for its internal >>> circuits and other analog IP blocks. The analog-to-digital >>> converter (ADC) produces an output value that is proportional >>> to the silicon temperature. >> >> Hi krzysztof, >> >> Any comments on this version? > > You got Rob's review, so you don't need also mine. > > If you want, then in general look okay, except the description for "reg" > you could split per items: > > reg: > items: > - description: VTM cfg1 register space > - description: VTM cfg2 register space > - description: efuse register space > > It's more obvious what items you expect.
Hi Krzysztof,
DTEX Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml: found duplicate key "description" with value "VTM cfg2 register space" (original value: "VTM cfg1 register space") Documentation/devicetree/bindings/Makefile:26: recipe for target 'Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts' failed make[1]: *** [Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts] Er
I believe multiple instances of description is failing. So can i keep the description as is?
- Keerthy
> > Best regards, > Krzysztof
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