| Date | Thu, 1 Dec 2022 13:40:26 -0600 | From | Rob Herring <> | Subject | Re: [PATCH v2 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible |
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On Wed, 30 Nov 2022 21:09:40 +0100, Adam Skladowski wrote: > Document compatible for tsens on Qualcomm SM6115 platform > according to downstream dts it ship v2.4 of IP > > Signed-off-by: Adam Skladowski <a39.skl@gmail.com> > Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> > --- > Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 + > 1 file changed, 1 insertion(+) >
Since Daniel is out, applied, thanks!
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