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SubjectRe: [PATCH v2 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible
On Wed, 30 Nov 2022 21:09:40 +0100, Adam Skladowski wrote:
> Document compatible for tsens on Qualcomm SM6115 platform
> according to downstream dts it ship v2.4 of IP
>
> Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
> ---
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
> 1 file changed, 1 insertion(+)
>

Since Daniel is out, applied, thanks!

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