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SubjectRe: [PATCH] dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
On Wed, Nov 16, 2022 at 3:40 PM Neil Armstrong
<neil.armstrong@linaro.org> wrote:
>
> The Qualcomm SM8550 platform has three instances of the tsens block,
> add a compatible for these instances.
>
> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>

Acked-by: Amit Kucheria <amitk@kernel.org>

> ---
> To: Andy Gross <agross@kernel.org>
> To: Bjorn Andersson <andersson@kernel.org>
> To: Konrad Dybcio <konrad.dybcio@somainline.org>
> To: Amit Kucheria <amitk@kernel.org>
> To: Thara Gopinath <thara.gopinath@gmail.com>
> To: "Rafael J. Wysocki" <rafael@kernel.org>
> To: Daniel Lezcano <daniel.lezcano@linaro.org>
> To: Zhang Rui <rui.zhang@intel.com>
> To: Rob Herring <robh+dt@kernel.org>
> To: Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>
> Cc: linux-arm-msm@vger.kernel.org
> Cc: linux-pm@vger.kernel.org
> Cc: devicetree@vger.kernel.org
> Cc: linux-kernel@vger.kernel.org
> ---
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
> 1 file changed, 1 insertion(+)
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index f0bd4b979e28..09dbd96d380e 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -58,6 +58,7 @@ properties:
> - qcom,sm8250-tsens
> - qcom,sm8350-tsens
> - qcom,sm8450-tsens
> + - qcom,sm8550-tsens
> - const: qcom,tsens-v2
>
> - description: v2 of TSENS with combined interrupt
>
> ---
> base-commit: 3c1f24109dfc4fb1a3730ed237e50183c6bb26b3
> change-id: 20221114-narmstrong-sm8550-upstream-tsens-dfaec218c321
>
> Best regards,
> --
> Neil Armstrong <neil.armstrong@linaro.org>

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