Messages in this thread | | | From | Amit Kucheria <> | Date | Sun, 20 Nov 2022 12:22:07 +0530 | Subject | Re: [PATCH] dt-bindings: thermal: qcom-tsens: Add compatible for sm8550 |
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On Wed, Nov 16, 2022 at 3:40 PM Neil Armstrong <neil.armstrong@linaro.org> wrote: > > The Qualcomm SM8550 platform has three instances of the tsens block, > add a compatible for these instances. > > Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
> --- > To: Andy Gross <agross@kernel.org> > To: Bjorn Andersson <andersson@kernel.org> > To: Konrad Dybcio <konrad.dybcio@somainline.org> > To: Amit Kucheria <amitk@kernel.org> > To: Thara Gopinath <thara.gopinath@gmail.com> > To: "Rafael J. Wysocki" <rafael@kernel.org> > To: Daniel Lezcano <daniel.lezcano@linaro.org> > To: Zhang Rui <rui.zhang@intel.com> > To: Rob Herring <robh+dt@kernel.org> > To: Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org> > Cc: linux-arm-msm@vger.kernel.org > Cc: linux-pm@vger.kernel.org > Cc: devicetree@vger.kernel.org > Cc: linux-kernel@vger.kernel.org > --- > Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 + > 1 file changed, 1 insertion(+) > > diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > index f0bd4b979e28..09dbd96d380e 100644 > --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > @@ -58,6 +58,7 @@ properties: > - qcom,sm8250-tsens > - qcom,sm8350-tsens > - qcom,sm8450-tsens > + - qcom,sm8550-tsens > - const: qcom,tsens-v2 > > - description: v2 of TSENS with combined interrupt > > --- > base-commit: 3c1f24109dfc4fb1a3730ed237e50183c6bb26b3 > change-id: 20221114-narmstrong-sm8550-upstream-tsens-dfaec218c321 > > Best regards, > -- > Neil Armstrong <neil.armstrong@linaro.org>
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