Messages in this thread | | | Subject | Re: [PATCH v2 08/12] i2c: designware: Introduce platform drivers glue layer interface | From | Jarkko Nikula <> | Date | Wed, 20 May 2020 15:46:11 +0300 |
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Hi
On 5/10/20 12:50 PM, Serge Semin wrote: > Seeing the DW I2C platform driver is getting overcomplicated with a lot of > vendor-specific configs let's introduce a glue-layer interface so new > platforms which equipped with Synopsys Designware APB I2C IP-core would > be able to handle their peculiarities in the dedicated objects. > Comment to this patch and patches 9/12 and 12/12:
Currently i2c-designware-platdrv.c is about 500 lines of code so I don't think it's too overcomplicated. But I feel we have already too many Kconfig options and source modules for i2c-designware and obviously would like to push back a little from adding more.
I don't think i2c-designware-platdrv.c becomes yet too complicated if Baikal related code is added there, perhaps under #ifdef CONFIG_OF like MSCC Ocelot code is currently.
-- Jarkko
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