Messages in this thread | | | Date | Tue, 18 Feb 2020 15:31:37 -0600 | From | Rob Herring <> | Subject | Re: [PATCH v3 3/6] dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings |
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On Mon, 10 Feb 2020 00:04:08 +0530, Sibi Sankar wrote: > From: David Dai <daidavid1@codeaurora.org> > > Redefine the Network-on-Chip devices to more accurately describe > the interconnect topology on Qualcomm's SDM845 platform. Each > interconnect device can communicate with different instances of the > RPMh hardware which are described as RSCs(Resource State Coordinators). > > Signed-off-by: David Dai <daidavid1@codeaurora.org> > Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> > Signed-off-by: Sibi Sankar <sibis@codeaurora.org> > --- > .../bindings/interconnect/qcom,sdm845.yaml | 49 +++++++++++++++---- > 1 file changed, 40 insertions(+), 9 deletions(-) >
Reviewed-by: Rob Herring <robh@kernel.org>
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