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SubjectRe: [PATCH v3 3/6] dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings
On Mon, 10 Feb 2020 00:04:08 +0530, Sibi Sankar wrote:
> From: David Dai <daidavid1@codeaurora.org>
>
> Redefine the Network-on-Chip devices to more accurately describe
> the interconnect topology on Qualcomm's SDM845 platform. Each
> interconnect device can communicate with different instances of the
> RPMh hardware which are described as RSCs(Resource State Coordinators).
>
> Signed-off-by: David Dai <daidavid1@codeaurora.org>
> Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
> Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
> ---
> .../bindings/interconnect/qcom,sdm845.yaml | 49 +++++++++++++++----
> 1 file changed, 40 insertions(+), 9 deletions(-)
>

Reviewed-by: Rob Herring <robh@kernel.org>

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