Messages in this thread | | | From | <> | Subject | Re: [PATCH] mtd: spi-nor: winbond: Add support for w25m512jw | Date | Mon, 7 Dec 2020 17:26:57 +0000 |
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Hi, Lad,
On 10/16/20 2:55 PM, Lad Prabhakar wrote: > EXTERNAL EMAIL: Do not click links or open attachments unless you know the content is safe > > This chip is (nearly) identical to the Winbond w25m512jv which is > already supported by Linux. Compared to the w25m512jv, the 'jw' > has a different JEDEC ID.
W25M512JW-IQ (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory, introduces a new “Software Die Select (C2h)” instruction, which we don't support. I guess you can't access the second die with what we have in mainline. Or am I wrong? We'll need to add support for multi-die support if we want to add new multi-die flashes.
ta
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