Messages in this thread | | | Subject | Re: [PATCH 1/2] dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings | From | David Dai <> | Date | Wed, 24 Jul 2019 13:42:19 -0700 |
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On 7/24/2019 11:27 AM, Stephen Boyd wrote: > Quoting David Dai (2019-07-24 10:22:57) >> The way that I view this is that the consumers consume both bandwidth >> and QoS from these physical NoC devices by getting some path between two >> endpoints on these different NoCs and applying some constraints. The NoC >> providers can accomplish that either by writing to MMIO spaces or by >> talking to some remote processor/hardware to tune its clock speed. The >> consumer doesn't interact with the RSCs directly, but can select a >> different bcm voter based on the endpoints that are associated with a >> particular bcm(apps or disp rsc). Each node(endpoints) will have its own >> BCM designation and an unique bcm voter. > Ok. I get it now. The MMIO nodes will be interconnect providers and > they'll know what RSCs they can use by exposing the same RSC "resource" > multiple times for each RSC that can be targeted? This is what the > postfix is with _DISP on your examples? Presumably there's an _APPS > version of the same prefixed endpoint in case the consumer wants to use > the APPS RSC instead of the DISP one, or maybe there's just no postfix > in this case because APPS is the "default".
Right, the suffixes will denote the RSC association and will default to APPS otherwise.
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