Messages in this thread | | | From | Len Brown <> | Date | Wed, 8 May 2019 15:45:24 -0400 | Subject | Re: [PATCH 10/22] powercap/intel_rapl: Support multi-die/package |
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On Tue, May 7, 2019 at 8:15 AM Peter Zijlstra <peterz@infradead.org> wrote: > > On Mon, May 06, 2019 at 05:26:05PM -0400, Len Brown wrote: > > From: Zhang Rui <rui.zhang@intel.com> > > > > RAPL "package" domains are actually implemented in hardware per-die. > > Thus, the new multi-die/package systems have mulitple domains > > within each physical package. > > > > Update the intel_rapl driver to be "die aware" -- exporting multiple > > domains within a single package, when present. > > No change on single die/package systems. > > > > Signed-off-by: Zhang Rui <rui.zhang@intel.com> > > Signed-off-by: Len Brown <len.brown@intel.com> > > Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> > > Cc: linux-pm@vger.kernel.org > > --- > > drivers/powercap/intel_rapl.c | 4 ++-- > > 1 file changed, 2 insertions(+), 2 deletions(-) > > > > diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c > > index 3c3c0c23180b..9202dbcef96d 100644 > > --- a/drivers/powercap/intel_rapl.c > > +++ b/drivers/powercap/intel_rapl.c > > @@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */ > > /* caller to ensure CPU hotplug lock is held */ > > static struct rapl_package *rapl_find_package_domain(int cpu) > > { > > - int id = topology_physical_package_id(cpu); > > + int id = topology_logical_die_id(cpu); > > struct rapl_package *rp;
> Both functions are still misnomers. rapl_find_package_domain() does in > fact now do rapl_find_die_domain(), right? Same for rapl_add_package()
A "RAPL Package Domain" (rapl_package, above) is a known proper noun -- it is a known documented capability.
When there could be just 1 die in a package, the name of this capability also always matched the scope of a physical package.
Now that some products have two die in the same package, there can be two of these inside a package, and they are associated with each die.
There are no plans to re-name the Package RAPL Domain capability in the hardware documentation.
Similarly, there are no plans to re-name any of the other "PACKAGE" scoped MSRs to have "DIE" in their name instead. The ship with those names sailed long ago.
I think the code above reflects its function, and that somebody maintaining it will be clear on this. That is important, because in the future, there will be a concept of PACKAGE scoped MSRs that span multiple DIE...
cheers, Len Brown, Intel Open Source Technology Center
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