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    Subject[PATCH 11/22] thermal/x86_pkg_temp_thermal: Support multi-die/package
    Date
    From: Zhang Rui <rui.zhang@intel.com>

    Package temperature sensors are actually implemented in hardware per-die.
    Thus, the new multi-die/package systems sport mulitple package thermal
    zones for each package.

    Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can
    expose multiple zones per package, instead of just one.

    Signed-off-by: Zhang Rui <rui.zhang@intel.com>
    Signed-off-by: Len Brown <len.brown@intel.com>
    ---
    drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 ++++----
    1 file changed, 4 insertions(+), 4 deletions(-)

    diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
    index 1ef937d799e4..405b3858900a 100644
    --- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
    +++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
    @@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
    */
    static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
    {
    - int pkgid = topology_logical_package_id(cpu);
    + int pkgid = topology_logical_die_id(cpu);

    if (pkgid >= 0 && pkgid < max_packages)
    return packages[pkgid];
    @@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)

    static int pkg_temp_thermal_device_add(unsigned int cpu)
    {
    - int pkgid = topology_logical_package_id(cpu);
    + int pkgid = topology_logical_die_id(cpu);
    u32 tj_max, eax, ebx, ecx, edx;
    struct pkg_device *pkgdev;
    int thres_count, err;
    @@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
    * worker will see the package anymore.
    */
    if (lastcpu) {
    - packages[topology_logical_package_id(cpu)] = NULL;
    + packages[topology_logical_die_id(cpu)] = NULL;
    /* After this point nothing touches the MSR anymore. */
    wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
    pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
    @@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
    if (!x86_match_cpu(pkg_temp_thermal_ids))
    return -ENODEV;

    - max_packages = topology_max_packages();
    + max_packages = topology_max_packages() * topology_max_die_per_package();
    packages = kcalloc(max_packages, sizeof(struct pkg_device *),
    GFP_KERNEL);
    if (!packages)
    --
    2.18.0-rc0
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