Messages in this thread Patch in this message | | | From | Len Brown <> | Subject | [PATCH 10/18] powercap/intel_rapl: Support multi-die/package | Date | Wed, 1 May 2019 00:24:19 -0400 |
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From: Zhang Rui <rui.zhang@intel.com>
RAPL "package" domains are actually implemented in hardware per-die. Thus, the new multi-die/package systems have mulitple domains within each physical package.
Update the intel_rapl driver to be "die aware" -- exporting multiple domains within a single package, when present. No change on single die/package systems.
Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Cc: linux-pm@vger.kernel.org --- drivers/powercap/intel_rapl.c | 4 ++-- 1 file changed, 2 insertions(+), 2 deletions(-)
diff --git a/drivers/powercap/intel_rapl.c b/drivers/powercap/intel_rapl.c index 3c3c0c23180b..9202dbcef96d 100644 --- a/drivers/powercap/intel_rapl.c +++ b/drivers/powercap/intel_rapl.c @@ -266,7 +266,7 @@ static struct rapl_domain *platform_rapl_domain; /* Platform (PSys) domain */ /* caller to ensure CPU hotplug lock is held */ static struct rapl_package *rapl_find_package_domain(int cpu) { - int id = topology_physical_package_id(cpu); + int id = topology_logical_die_id(cpu); struct rapl_package *rp; list_for_each_entry(rp, &rapl_packages, plist) { @@ -1459,7 +1459,7 @@ static void rapl_remove_package(struct rapl_package *rp) /* called from CPU hotplug notifier, hotplug lock held */ static struct rapl_package *rapl_add_package(int cpu) { - int id = topology_physical_package_id(cpu); + int id = topology_logical_die_id(cpu); struct rapl_package *rp; int ret; -- 2.18.0-rc0
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