Messages in this thread | | | Date | Wed, 20 Feb 2019 11:15:21 +0100 | From | Peter Zijlstra <> | Subject | Re: [PATCH 00/10] perf: Multi-die/package support |
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On Tue, Feb 19, 2019 at 12:00:01PM -0800, kan.liang@linux.intel.com wrote: > From: Kan Liang <kan.liang@linux.intel.com> > > Add Linux perf support for multi-die/package. The first product with > multi-die is Xeon Cascade Lake-AP (CLX-AP). > The code bases on the top of Len's multi-die/package support. > https://lkml.org/lkml/2019/2/18/1534
*sigh*, don't use lkml.org links.
We have a perfectly good canonical form:
https://lkml.kernel.org/r/20190219034013.4147-1-lenb@kernel.org
which has the added benefit of including the Message-Id such that I can easily find the email in my local archive.
And since Len forgot to Cc me on those, I suppose I'll have to go dig them out to make sense of these here patches.
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