Messages in this thread | | | Subject | Re: [PATCH v3 7/7] arm64: dts: qcom: Add mx power domain as thermal warming device. | From | Thara Gopinath <> | Date | Wed, 30 Oct 2019 10:23:36 -0400 |
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On 10/28/2019 09:31 PM, Rob Herring wrote: > On Wed, Oct 16, 2019 at 03:37:21PM -0400, Thara Gopinath wrote: >> RPMh hosts mx power domain that can be used to warm up the SoC. >> Add sub-node to rpmhpd node for mx to be recognized >> as thermal warming device on sdm845. >> >> Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org> >> --- >> arch/arm64/boot/dts/qcom/sdm845.dtsi | 5 +++++ >> 1 file changed, 5 insertions(+) >> >> diff --git a/arch/arm64/boot/dts/qcom/sdm845.dtsi b/arch/arm64/boot/dts/qcom/sdm845.dtsi >> index 0222f48..0671c8a 100644 >> --- a/arch/arm64/boot/dts/qcom/sdm845.dtsi >> +++ b/arch/arm64/boot/dts/qcom/sdm845.dtsi >> @@ -3788,6 +3788,11 @@ >> opp-level = <RPMH_REGULATOR_LEVEL_TURBO_L1>; >> }; >> }; >> + >> + mx_cdev: mx { >> + #cooling-cells = <2>; >> + .name = "mx"; > > Copy this from C code? Hi Rob,
What do you mean ?
> >> + }; >> }; >> >> rsc_hlos: interconnect { >> -- >> 2.1.4 >>
-- Warm Regards Thara
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