lkml.org 
[lkml]   [2018]   [Sep]   [6]   [last100]   RSS Feed
Views: [wrap][no wrap]   [headers]  [forward] 
 
Messages in this thread
/
SubjectRe: [linux-sunxi] Re: [PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths
From
Date


On 06.09.2018 14:04, Icenowy Zheng wrote:
>
>
> 于 2018年9月6日 GMT+08:00 下午7:51:15, Maxime Ripard <maxime.ripard@bootlin.com> 写到:
>> On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:
>>> On 04.09.2018 18:46, Emmanuel Vadot wrote:
>>>>> + /* Data cells */
>>>>> + thermal_calibration: calib@234 {
>>>>> + reg = <0x234 0x8>;
>>>>> + };
>>>> You are declaring 8 bytes of calibration data but to my knowledge
>> it's
>>>> only 2 bytes per sensor, so 2 bytes for H3.
>>>> Am I missing something ?
>>>>
>>>> Thanks,
>>>
>>> Emmanuel you are right, it is 2 bytes per Sensor and should be 2
>> bytes for
>>> H3, but the thermal calibration data field is on all chips 64 bit
>> wide - so
>>> 8 bytes. So I'm reading here the complete calibration data field.
>>
>> Having one cell per channel would make more sense I guess.
Ok I will change this.
>
> I have mentioned that this is impossible because of wrong
> addressing caused by LE2BE in SID driver.
>
I know! But I would like to prepare patches for it, that they can be
merged when this is fixed.

Philipp

\
 
 \ /
  Last update: 2018-09-06 14:19    [W:0.142 / U:0.024 seconds]
©2003-2020 Jasper Spaans|hosted at Digital Ocean and TransIP|Read the blog|Advertise on this site