Messages in this thread | | | Subject | Re: [linux-sunxi] Re: [PATCH v3 27/30] ARM: dts: sun8i: h3: use calibration for ths | From | Philipp Rossak <> | Date | Thu, 6 Sep 2018 14:18:45 +0200 |
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On 06.09.2018 14:04, Icenowy Zheng wrote: > > > 于 2018年9月6日 GMT+08:00 下午7:51:15, Maxime Ripard <maxime.ripard@bootlin.com> 写到: >> On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote: >>> On 04.09.2018 18:46, Emmanuel Vadot wrote: >>>>> + /* Data cells */ >>>>> + thermal_calibration: calib@234 { >>>>> + reg = <0x234 0x8>; >>>>> + }; >>>> You are declaring 8 bytes of calibration data but to my knowledge >> it's >>>> only 2 bytes per sensor, so 2 bytes for H3. >>>> Am I missing something ? >>>> >>>> Thanks, >>> >>> Emmanuel you are right, it is 2 bytes per Sensor and should be 2 >> bytes for >>> H3, but the thermal calibration data field is on all chips 64 bit >> wide - so >>> 8 bytes. So I'm reading here the complete calibration data field. >> >> Having one cell per channel would make more sense I guess. Ok I will change this. > > I have mentioned that this is impossible because of wrong > addressing caused by LE2BE in SID driver. > I know! But I would like to prepare patches for it, that they can be merged when this is fixed.
Philipp
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