Messages in this thread | | | Subject | Re: [RFC PATCH 0/7] Introduce thermal pressure | From | Daniel Lezcano <> | Date | Thu, 11 Oct 2018 10:23:14 +0200 |
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On 11/10/2018 09:35, Lukasz Luba wrote: > Hi Daniel, > > On 10/10/2018 06:54 PM, Daniel Lezcano wrote: >> On 10/10/2018 17:35, Lukasz Luba wrote: >>> Hi Thara, >>> >>> I have run it on Exynos5433 mainline. >>> When it is enabled with step_wise thermal governor, >>> some of my tests are showing ~30-50% regression (i.e. hackbench), >>> dhrystone ~10%. >>> >>> Could you tell me which thermal governor was used in your case? >>> Please also share the name of that benchmark, i will give it a try. >>> Is it single threaded compute-intensive? >> >> aobench AFAICT >> >> It would be interesting if you can share the thermal profile of your board. >> > Thanks for the benchmark name. > It was tested on Samsung TM2 device with Exynos 5433 with debian. > Thermal stuff you can find in mainline: > arch/arm64/boot/dts/exynos/exynos5433-tmu.dtsi
By thermal profile, I was meaning a figure with the temperature regulation (temperature idle, then workload, then temperature increase, mitigated temperature, end of workload, temperature decrease).
The thermal description looks wrong in the DT. I suggest to experiment the series with the DT fixed.
eg. from hi6220.dtsi
thermal-zones {
cls0: cls0 { polling-delay = <1000>; polling-delay-passive = <100>; sustainable-power = <3326>;
/* sensor ID */ thermal-sensors = <&tsensor 2>;
trips { threshold: trip-point@0 { temperature = <65000>; hysteresis = <0>; type = "passive"; };
target: trip-point@1 { temperature = <75000>; hysteresis = <0>; type = "passive"; }; };
cooling-maps { map0 { trip = <&target>; cooling-device = <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; }; }; }; };
Note the cooling devices are *passive*
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