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    SubjectRe: [RFC PATCH 0/7] Introduce thermal pressure
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    On 11/10/2018 09:35, Lukasz Luba wrote:
    > Hi Daniel,
    >
    > On 10/10/2018 06:54 PM, Daniel Lezcano wrote:
    >> On 10/10/2018 17:35, Lukasz Luba wrote:
    >>> Hi Thara,
    >>>
    >>> I have run it on Exynos5433 mainline.
    >>> When it is enabled with step_wise thermal governor,
    >>> some of my tests are showing ~30-50% regression (i.e. hackbench),
    >>> dhrystone ~10%.
    >>>
    >>> Could you tell me which thermal governor was used in your case?
    >>> Please also share the name of that benchmark, i will give it a try.
    >>> Is it single threaded compute-intensive?
    >>
    >> aobench AFAICT
    >>
    >> It would be interesting if you can share the thermal profile of your board.
    >>
    > Thanks for the benchmark name.
    > It was tested on Samsung TM2 device with Exynos 5433 with debian.
    > Thermal stuff you can find in mainline:
    > arch/arm64/boot/dts/exynos/exynos5433-tmu.dtsi

    By thermal profile, I was meaning a figure with the temperature
    regulation (temperature idle, then workload, then temperature increase,
    mitigated temperature, end of workload, temperature decrease).

    The thermal description looks wrong in the DT. I suggest to experiment
    the series with the DT fixed.

    eg. from hi6220.dtsi


    thermal-zones {

    cls0: cls0 {
    polling-delay = <1000>;
    polling-delay-passive = <100>;
    sustainable-power = <3326>;

    /* sensor ID */
    thermal-sensors = <&tsensor 2>;

    trips {
    threshold: trip-point@0 {
    temperature = <65000>;
    hysteresis = <0>;
    type = "passive";
    };

    target: trip-point@1 {
    temperature = <75000>;
    hysteresis = <0>;
    type = "passive";
    };
    };

    cooling-maps {
    map0 {
    trip = <&target>;
    cooling-device = <&cpu0
    THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
    };
    };
    };
    };

    Note the cooling devices are *passive*


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