Messages in this thread | | | Subject | Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings | From | "Wangtao (Kevin, Kirin)" <> | Date | Mon, 4 Sep 2017 14:39:04 +0800 |
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在 2017/9/1 2:24, Daniel Lezcano 写道: > On 29/08/2017 10:17, Tao Wang wrote: >> From: Tao Wang <kevin.wangtao@linaro.org> >> >> This adds documentation of device tree bindings for the >> thermal sensor controller of hi3660 SoC. >> >> Signed-off-by: Tao Wang <kevin.wangtao@linaro.org> >> --- >> .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++ >> 1 file changed, 37 insertions(+) >> create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> >> diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> new file mode 100644 >> index 0000000..4643dbe >> --- /dev/null >> +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> @@ -0,0 +1,37 @@ >> +* Temperature Sensor on hisilicon SoC >> + >> +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D >> +area contains a temperture sensor. The temperture sensor produces an output >> +value which has a linear relationship with the temperture of the area. >> + > > s/temperture/temperature/ THX > >> +for Hi3660, >> +sensor0 monitors the temperture of A53; >> +sensor1 monitors the temperture of A72; >> +sensor2 monitors the temperture of GPU; >> +sensor3 is a virtual sensor, which produces the maximum value of all sensors; >> +sensor4 is a virtual sensor, which produces the average value of all sensors. > > I don't think we need to escribe the virtual sensors in the DT bindings. I just want to let user know the sensor id of virtual sensor, I also define it in header file, so the header file is enough? > >> +** Required properties : >> +- compatible: "hisilicon,thermal-tsensor". >> +- reg: physical reg address of thermal sensor and length of memory mapped >> + region. >> +- hisi,tsensors: number of hardware tsensors >> +- hisi,coef: An array of integers (one signed cell) containing >> + coefficients to turn adc value to temperture. >> +- hisi,adc-range: adc value range, minimum value is followed by maximum value. >> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. >> + >> +Example : >> +Hi3660: >> +tsensor: tsensor@fff30000 { >> + compatible = "hisilicon,hi3660-tsensor"; >> + #address-cells = <2>; >> + #size-cells = <2>; >> + reg = <0x0 0xfff3001c 0x0 0x4>, >> + <0x0 0xfff3005c 0x0 0x4>, >> + <0x0 0xfff3009c 0x0 0x4>; >> + hisi,tsensors = <HISI_MAX_TSENSORS>; >> + hisi,coef = <165000 (-40000)>; >> + hisi,adc-range = <0x74 0x39A>; > > Do we really need max sensors, coef and adc range to be specified in the DT? > > Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the > coef, adc, in the driver itself? My purpose is to make the driver be compitable with our future platform. > > Can't this binding be merged with the hisilicon-thermal.txt? > > Thanks. > > -- Daniel > >
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