Messages in this thread | | | Date | Fri, 30 Jun 2017 20:05:36 -0700 | From | Eduardo Valentin <> | Subject | Re: [Patch v2 1/3] dt-bindings: Document the hi3660 thermal sensor bindings |
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On Thu, Jun 22, 2017 at 11:42:01AM +0800, Tao Wang wrote: > This adds documentation of device tree bindings for the > thermal sensor controller of hi3660 SoC. > > Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> > --- > Changes in v2: > - remove redundant property > > .../devicetree/bindings/thermal/hi3660-thermal.txt | 16 ++++++++++++++++ > 1 file changed, 16 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > > diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > new file mode 100644 > index 0000000..f3dddcf > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > @@ -0,0 +1,16 @@ > +* Temperature Sensor on hisilicon hi3660 SoC > +
Would you mind add some more description of the sensors/where to find further hardware documentation?
> +** Required properties : > + > +- compatible: "hisilicon,thermal-hi3660". > +- reg: physical base address of thermal sensor and length of memory mapped > + region. > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > + > +Example : > + > + tsensor: tsensor { > + compatible = "hisilicon,thermal-hi3660"; > + reg = <0x0 0xfff30000 0x0 0x1000>; > + #thermal-sensor-cells = <1>; > + }; > -- > 1.7.9.5 >
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