Messages in this thread | | | Date | Wed, 18 Jun 2014 15:17:48 -0700 | From | Stephen Boyd <> | Subject | Re: [PATCH] thermal: Bind cooling devices with the correct arguments |
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On 06/17/14 03:20, Punit Agrawal wrote: > Ping? > > Punit Agrawal <punit.agrawal@arm.com> writes: > >> When binding cooling devices to thermal zones created from the device >> tree the minimum and maximum cooling states are in the wrong order >> leading to failure to bind. >> >> Fix the order of cooling states in the call to >> thermal_zone_bind_cooling_device to fix this. >> >> Cc:Zhang Rui <rui.zhang@intel.com> >> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Ah I ran into the same problem while testing out some thermal DT stuff.
Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>
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