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SubjectRe: [PATCHv4 00/18] device thermal limits represented in device tree nodes (v4)
On 26-09-2013 23:13, Eduardo Valentin wrote:
> Hello all,
>
> Here is the continuation of work of representing hardware thermal properties
> in device tree infrastructure. The present patch series is the fourth version
> of this work. Previous versions were sent as RFCs and can be found here:
> V3:

Too fast, hit send too early. For those interested, here is the link to V3:
https://lkml.org/lkml/2013/9/15/122

> RFCv2: http://lkml.org/lkml/2013/8/23/594
> RFCv1: http://lkml.org/lkml/2013/7/22/319
>
> Major difference from V3 is on the parser itself. I have updated the binding
> documentation and improved the code accordingly to previous comments mainly
> from Mark R. and Joe P.
>
> The changes on hwmon drivers have been accepted by Guenter, and in this
> series I am including his Acked-by, as I didn't change anything on that side.
>
> I also found a bug while using all involved code built as modules, thus
> I have reworked a bit the cooling device registration part. This is why
> there are two new patches in this series (patches 02 and 04).
>
> Tests were done, just like in V3, on TI OMAP4430, OMAP4460, OMAP5430 and DRA7,
> although this series is not including the DRA7 part (I will be sending separately).
>
> Thanks all who have been contributing reviewing this code.
>
> All best,
>
> Eduardo Valentin (18):
> thermal: allow registering without .get_temp
> thermal: core: allow binding via .bind when tzp is present
> thermal: introduce device tree parser
> thermal: core: introduce thermal_of_cooling_device_register
> thermal: cpu_cooling: introduce of_cpufreq_cooling_register
> cpufreq: cpufreq-cpu0: add dt node parsing for cooling device
> properties
> hwmon: lm75: expose to thermal fw via DT nodes
> hwmon: tmp102: expose to thermal fw via DT nodes
> thermal: ti-soc-thermal: use thermal DT infrastructure
> arm: dts: add omap4 CPU thermal data
> arm: dts: add omap4430 thermal data
> arm: dts: add omap4460 thermal data
> arm: dts: add cooling properties on omap4430 cpu node
> arm: dts: add cooling properties on omap4460 cpu node
> arm: dts: add omap5 GPU thermal data
> arm: dts: add omap5 CORE thermal data
> arm: dts: add omap5 thermal data
> arm: dts: add cooling properties on omap5 cpu node
>
> .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 +
> .../devicetree/bindings/thermal/thermal.txt | 537 +++++++++++++
> arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 +
> arch/arm/boot/dts/omap443x.dtsi | 15 +-
> arch/arm/boot/dts/omap4460.dtsi | 15 +-
> arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 +
> arch/arm/boot/dts/omap5.dtsi | 15 +-
> drivers/cpufreq/Kconfig | 2 +-
> drivers/cpufreq/cpufreq-cpu0.c | 16 +
> drivers/hwmon/lm75.c | 35 +-
> drivers/hwmon/tmp102.c | 19 +
> drivers/thermal/Kconfig | 14 +
> drivers/thermal/Makefile | 1 +
> drivers/thermal/cpu_cooling.c | 56 +-
> drivers/thermal/of-thermal.c | 845 +++++++++++++++++++++
> drivers/thermal/thermal_core.c | 79 +-
> drivers/thermal/thermal_core.h | 9 +
> drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +-
> include/dt-bindings/thermal/thermal.h | 27 +
> include/linux/cpu_cooling.h | 25 +
> include/linux/thermal.h | 32 +-
> 22 files changed, 1880 insertions(+), 43 deletions(-)
> create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
> create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi
> create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi
> create mode 100644 drivers/thermal/of-thermal.c
> create mode 100644 include/dt-bindings/thermal/thermal.h
>


--
You have got to be excited about what you are doing. (L. Lamport)

Eduardo Valentin

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