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Subject[PATCHv4 02/18] thermal: core: allow binding via .bind when tzp is present
Date
This patch allows drivers register thermal zone devices
with thermal zone params and .bind callbacks. In this case,
it will use the .bind callback.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
---
drivers/thermal/thermal_core.c | 2 +-
1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/drivers/thermal/thermal_core.c b/drivers/thermal/thermal_core.c
index 8a94300..f7a9f4f 100644
--- a/drivers/thermal/thermal_core.c
+++ b/drivers/thermal/thermal_core.c
@@ -247,7 +247,7 @@ static void bind_cdev(struct thermal_cooling_device *cdev)
if (!pos->tzp && !pos->ops->bind)
continue;

- if (!pos->tzp && pos->ops->bind) {
+ if (pos->ops->bind) {
ret = pos->ops->bind(pos, cdev);
if (ret)
print_bind_err_msg(pos, cdev, ret);
--
1.8.2.1.342.gfa7285d


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