Messages in this thread Patch in this message | | | From | Eduardo Valentin <> | Subject | [PATCHv4 02/18] thermal: core: allow binding via .bind when tzp is present | Date | Thu, 26 Sep 2013 23:13:09 -0400 |
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This patch allows drivers register thermal zone devices with thermal zone params and .bind callbacks. In this case, it will use the .bind callback.
Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> --- drivers/thermal/thermal_core.c | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-)
diff --git a/drivers/thermal/thermal_core.c b/drivers/thermal/thermal_core.c index 8a94300..f7a9f4f 100644 --- a/drivers/thermal/thermal_core.c +++ b/drivers/thermal/thermal_core.c @@ -247,7 +247,7 @@ static void bind_cdev(struct thermal_cooling_device *cdev) if (!pos->tzp && !pos->ops->bind) continue; - if (!pos->tzp && pos->ops->bind) { + if (pos->ops->bind) { ret = pos->ops->bind(pos, cdev); if (ret) print_bind_err_msg(pos, cdev, ret); -- 1.8.2.1.342.gfa7285d
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