Messages in this thread | | | Date | Tue, 16 Jul 2013 22:17:02 +0200 | From | Peter Zijlstra <> | Subject | Re: [RFC][PATCH 0/9] sched: Power scheduler design proposal |
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On Tue, Jul 16, 2013 at 12:57:34PM -0700, Arjan van de Ven wrote: > then the question of how much remaining capacity; this is a hard one, and not just > for Intel. Almost all mobile devices today are thermally constrained, ARM and Intel > alike (at least the higher performance ones)... the curse of wanting very thin and light > phones that are made of thermally isolating plastic (so that radio waves can go through) > and have a nice and bright screen...
Right, so we might need to track a !idle avg over the thermal domain to guestimate the head-room and inter-cpu relations.
But yeah, I suppose what I've been saying is that we need to drag cpufreq into the SMP era. Only considering a single cpu isn't going to work anymore.
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